Sponsors » Current Support



Laser Tek Taiwan Co., Ltd.
Kaohsiung, USA
lasertek@lasertek.com.tw
www.lasertek.com.tw

Booth 41

Laser Marking; Laser Cutting; Laser Drilling; Laser Grooving; Laser Scribing; Laser Dicing; Laser Remover; TGV, TSV

Multiple laser wavelengths selection for different applications. Femto, Pico, Nano, YAG, YVO4.

Various laser light sources can be applied to various materials. Glass, Si, SiC, PI, ABF, Ceramic, FR4, FPC, Multi-layer Material.